Ultrasonic Agitation Effects on the Electrodeposition Of Copper From a Cupric-EDTA Bath

The texture coefficients of the (111) and (200) planes of deposited films of copper were strongly affected by ultrasonic agitation. In general, the texture coefficient of the (111) plane grew without ultrasonic agitation, but that of the (ZOO) plane increased greatly with it. Limiting current densities and cathodic current efficiencies both increased, while grain size was reduced. The stoichiometric number for disconnection of quadridentate ligands of EDTA was estimated to be about four, and that for the charge transfer of cupric ion to be about two. The rate-determining step had little or no effect; however, reaction rate increased.